Výměník deskový B10THx30/1P-SC, kondenzátor, SWEP

Compact high-performance plate heat exchangers, designed and produced using the parallel counter-flow principle. They consist of a precisely defined number of plates made from stainless steel that are soldered in a vacuum using 99.9% copper solder at a large number of supporting points between the plates to create a pressure-resistant unit with the first profiled plate fully sealed from the environment.

The hard soldered compact model V heater exchangers feature a special distribution device at the refrigerant inlet, i.e. normally attached to connection F3. This distribution device should ensure that the refrigerant is spread evenly in the channel. The liquid refrigerant must be connected to the lower left connection (F3) and the gas outlet (F1) to the upper left connection (F1). The heat transfer medium inlet must be connected to the upper left connection (F2) and the outlet to the lower right connection (F4). Devices with a width of at least 243 mm (B35 and above) have four additional M12 stud bolts welded to the front plate. Stainless steel heat exchangers in the B model series are used for heating or cooling liquid or gaseous media. The technical characteristics of these heat exchanges mean that good power transfer valves are achieved in just a small design volume.

The model B stands out for its extremely high pressure resistance. The burst pressure is at least 5x the maximum operating pressure. The operating pressure for S class heat exchangers is 31 bar at a max. temperature of 155 °C. For M class heat exchangers, this is 45 bar at a max. temperature of 135 °C.

Positioning
The heat exchanger is to be mounted in the upright position in order to ensure it can fully drain out. The arrow visible on the front plate must point upwards. The media must flow through the heat exchanger in the count-flow method. The piping is to be attached such that the connections are not under tension. The larger plate heat exchanger models (from B35, B120TH) have stud bolts on the front plate for attaching to a mount or frame. Large forces (torque moments) may arise on threaded connections. Solder connections should use silver solder with at least a 45% silver content and a melting temperature of 620 °C to 635 °C.

Materials
The plate device consists of a number of stainless steel plates embossed with a fishbone pattern. These plates are soldered using copper in a special vacuum soldering process at 1200 °C with 99.9% SF copper.
Plate material: EN10028/7-1.4401
Solder material: Pure copper
Connector material: EN 10272-1.4401

Application areas
Application areas are:

• building  services/utilities
• heat recovery
• refrigeration systems / evaporators / condensers / desuperheaters /
• the chemical industry
• special systems

Operating conditions
S class: (B10T, B12MT, B25T, B35, V25T, V80, V35)
Max. Operating pressure at +155 °C: 31 bar
Max. Operating pressure at +225 °C: 27 bar
Min. operating temperature: -196 °C
Design pressure: 50 bar

M class: (B5, B8, B15, B80, B120T, V120T)
Max. Operating pressure at +135 °C: 45 bar
Max. Operating pressure at +225 °C: 36 bar
Min. operating temperature: -196 °C
Design pressure: 75 bar

Performance calculation
We will be happy to determine your heat exchanger requirements for other application areas. Please provide us with the following information:
Refrigerant
Condensing capacity Q_c
Inlet temperature t_we
Outlet temperature t_wa
Instead of providing one of the two temperatures, t_we or t_wa, you can specify the water flow rate.