Harris Dynaflow is a self-flowing silver-containing copper-phosphor solder for copper-copper connections without the use of flux. It can also be used for brass and copper alloys using Stay-Silv® flux white or Stay-Silv® flux black.
Dynaflow is a low melting hard solder with very high requirements for the solder connection and good flow properties. Its properties are comparable to an L-Ag15P solder, but at a lower price.
Dynaflow has been specially developed for use in refrigeration and air conditioning systems and is an affordable alternative to solders with a high silver content. It can be used at temperatures down to -60 °C; the maximum operating temperature at the welded joint is 150 °C.
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